Air guiding structure

ABSTRACT

An air guiding structure includes a plurality of fins capable of swinging, an actuation member connected to each fin, and a memory deformable element connected to the outermost fin. When the memory deformable element is at a normal temperature, the fins remain at a normal angle; when deforming because of heat, the memory deformable element pulls the fins to swing. Further, the actuation member drives each fin to rotate to a working angle, and thus the air exhaustion direction is changed according to the temperature effect.

CROSS-REFERENCE TO RELATED APPLICATIONS

This non-provisional application claims priority under 35 U.S.C. §119(a)on Patent Application No(s). 097123809 filed in Taiwan, R.O.C. on Jun.25, 2008 the entire contents of which are hereby incorporated byreference.

BACKGROUND OF THE INVENTION

1. Field of Invention

The present invention relates to an air guiding structure, and moreparticularly to an air guiding structure capable of changing an airexhaustion direction according to the temperature.

2. Related Art

Electronic devices generate heat in operation. Therefore, to maintainthe normal operation of an electronic device, the heat dissipationdesign is very important. Taking a notebook computer for example, itsheat dissipation design is generally to dispose a heatsink fan insidethe host device, open an air inlet at the top or bottom of the hostdevice, and correspondingly open an air outlet on a side edge of thehost device. When the host device starts operating, the heatsink fandraws in cool air from the outside via the air inlet, then the cool airexchanges heat with a heat source (for example, the CPU) of the notebookcomputer, and then the heatsink fan exhausts the hot air via the airoutlet.

In order to prevent foreign substances from entering the notebookcomputer via the air inlet or outlet, a plurality of fins is fixed inthe air inlet and outlet. As the fins are generally perpendicular to thesurface of the main case, the air exhausted from the outlet is in adirection perpendicular to the surface of the main case. For example,the air outlet of the notebook computer is disposed on a side edge ofthe host device, and a hand of a user is on the same side of the airoutlet (for example, to operate a mouse). As a result, the hot airexhausted from the outlet will be directly blown to the hand of theuser, and cause discomfort to the user.

Of course, to solve the above problem, the air outlet of a notebookcomputer can be disposed on the rear end of the host device, and thusthe hot air will not be blown to the hand of the user. However,restricted by the size, in the market, the air outlet is disposed on aside edge of the host device of the notebook computer in most cases. Or,an adjustable fin is proposed by notebook computer manufacturers. Forinstance, U.S. Pat. No. 6,229,701 discloses a portable computer with aheat dissipating device. In this patent, heat dissipating slats, mountedpivotally in a ventilation hole, are movable between a close position tooverlap the ventilation hole and an open position at an angle. However,the adjustable heat dissipating slats in this patent are verycomplicated in structure.

SUMMARY OF THE INVENTION

Accordingly, as the fins fixed in the air outlet of a conventionalnotebook computer exhaust hot air in a fixed direction, and the heatdissipating slats mounted pivotally in the ventilation hole of anotebook computer have a quite complicated structure, neither of thesetwo designs is desirable for the air outlet of a notebook computer.Therefore, the present invention is directed to a temperature-sensitivefin structure capable of changing the air exhaustion direction accordingto the temperature effect.

An air guiding structure applicable to an electronic device with an airoutlet in a case of the electronic device is provided. The air guidingstructure includes a plurality of fins, an actuation member, and amemory deformable element. The fins are mounted in the air outlet andcapable of rotating. The actuation member is connected to each fin, soas to drive the fins to rotate in sync. The memory deformable elementhas one end fixed to the electronic device, and the other end connectedto the actuation member or directly connected to one of the fins (theoutermost fin), such that the memory deformable element under thermaldeformation pulls the fins to swing together. When the memory deformableelement is at a normal temperature, the fins remain at a normal angle,and when deforming due to heat generated in the electronic device, thememory deformable element pulls the fins to swing. Further, theactuation member drives each fin to swing together to a working angle,and thus the air exhaustion direction from the air outlet is changed.

According to the air guiding structure of the present invention, whenthe electronic device generates heat in operation, the memory deformableelement is heated and expands to pull the fins to swing to a workingangle. Therefore, the fins can change the air exhaustion directionaccording to the temperature effect of the electronic device. Thus, theprovided air guiding structure is an optimal design for an electronicdevice.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from thedetailed description given herein below for illustration only, and thusare not limitative of the present invention, and wherein:

FIG. 1 is a perspective view illustrating the structure of a firstembodiment of the present invention when applied to a notebook computer;

FIG. 2A is a perspective view illustrating the structure of the firstembodiment of the present invention;

FIG. 2B is a perspective view illustrating the operation of the firstembodiment of the present invention;

FIGS. 3A and 3B are schematic views illustrating the usage of the firstembodiment of the present invention;

FIG. 4 is a perspective view illustrating the structure of a secondembodiment of the present invention;

FIGS. 5A and 5B are perspective views illustrating the structure of athird embodiment of the present invention;

FIG. 6 is a perspective view of a fourth embodiment of the presentinvention;

FIGS. 7A and 7B are perspective views illustrating the usage of a fifthembodiment of the present invention;

FIG. 8 is a perspective view illustrating the usage of the fifthembodiment of the present invention;

FIG. 9 is a perspective view illustrating the usage of a sixthembodiment of the present invention; and

FIGS. 10A and 10B are perspective views illustrating the usage of aseventh embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The air guiding structure of the present invention is applicable to anelectronic device that generates heat in operation, such as a desktopcomputer, a server, or a notebook computer. The notebook computer istaken as the preferred embodiment of the present invention below forillustration.

Referring to FIG. 1, the air guiding structure of the present inventionis applicable to a notebook computer. The notebook computer has a hostdevice 10. The host device 10 has a heatsink fan 11 disposed therein,and has an air outlet 12 corresponding to the heatsink fan 11 on a sideedge.

FIGS. 2A and 2B show a first embodiment of the present invention.Referring to FIGS. 2A and 2B, the air guiding structure of thisembodiment includes a plurality of fins 13, an actuation member 14, anda memory deformable element 15. Each fin 13 is plate-like, and has apair of rotating shafts 131 respectively disposed at its top and bottom.The air outlet 12 has a plurality of dowel holes 121 respectivelydisposed at the top and bottom of its inner wall. The rotating shafts131 of the fins 13 are respectively fitted into the dowel holes 121 ofthe air outlet 12, and thus the fins 13 can rotate on the air outlet 12to change the angle. In addition, a connection portion 132 is disposedon the long side of each fin 13. The actuation member 14 is a bar-shapedrod, and has a plurality of ferrules 141 respectively corresponding tothe fins 13 disposed thereon. The connection portion 132 of each fin 13swings in the corresponding ferrule 141, so that the fins 13 areserially-connected and capable of rotating together when driven by theactuation member 14 to change the angle.

The memory deformable element 15 is spiral or in other possible shapes,for example, being irregular linear, bar-shaped, or plate-like. In thefirst embodiment, a spiral memory deformable element is taken as anexample. The memory deformable element 15 has one end fixed to a sideedge on the inner wall of the air outlet 12 (on the electronic device,i.e., the host device 10 of the notebook computer), and the other endconnected to one of the fins 13 (the outermost fin 13 in the figure). Inthe present invention, the memory deformable element 15, no matterdirectly connected to one of the fins 13 or connected to the actuationmember 14, can smoothly pull all the fins 13 to swing together. Further,the connection between the memory deformable element 15 and the fin 13enables the memory deformable element 15 to pull all the fins 13 toswing together when the memory deformable element 15 deforms because ofheat. Thereby, the aforementioned two implementation aspects are bothapplicable to the present invention, and the memory deformable element15 directly connected to one of the fins 13 is taken as an examplebelow.

The memory deformable element 15 is made of a Ni—Ti shape memory alloy,Cu—Zn—Al shape memory alloy, or Cu—Ni—Al shape memory alloy, and isdeformable according to the temperature. The memory deformable element15 has an expanded and deformed state at a normal temperature, and has acontracted original state when heated. In response to the deformation ofthe memory deformable element 15, the fins 13 remain at a normal angleat the normal temperature (for example, the heatsink fan 11 is not inoperation), and are pulled to swing by the memory deformable element 15when contracting due to thermal deformation (for example, the heatsinkfan 11 is in operation). Further, the actuation member 14 drives thefins 13 to swing together to a working angle. Referring to FIGS. 3A and3B together, in the air guiding structure of the present invention, thefins 13 are mounted in the air outlet 12 and capable of rotating. Theactuation member 14 is connected to each fin 13. The memory deformableelement 15 has one end connected to a side edge of the air outlet 12,and the other end connected to the outermost fin 13. The memorydeformable element 15 is in the expanded and deformed state at a normaltemperature (i.e., the notebook computer is not in operation), and thefins 13 remain at a normal angle. At this time, the fins 13 areperpendicular to the air outlet 12, as shown in FIG. 3A. When thenotebook computer starts operating, the heatsink fan 11 draws in coolair from the environment, then the cool air exchanges heat with a heatsource (not shown) of the notebook computer, and then the heatsink fan11 exhausts the hot air generated in the heat exchange via the airoutlet 12. The memory deformable element 15 in continuous contact withthe hot air will be heated. When the temperature of the memorydeformable element 15 reaches a transition temperature, the memorydeformable element 15 contracts to the contracted original state, andthus the fins 13 are pulled to swing. Further, the actuation member 14drives the fins 13 to swing together to a working angle, as shown inFIG. 3B.

In a specific application, when the notebook computer is just started,its temperature has not reached the transition temperature, and the hotair is still exhausted by the fins 13 of the air outlet 12 from a sideedge of the notebook computer. When the temperature of the hot air risesafter continuous operation of the notebook computer and finally reachesthe transition temperature, each fin 13 swings to the working angle. Theworking angle is an oblique angle toward the rear end of the notebookcomputer, such that the hot air is exhausted by the fins of the airoutlet 12 in an oblique angle toward the rear end of the notebookcomputer. Therefore, if a hand of a user is on the same side of the airoutlet to operate a mouse, the hot air will not be directly blown to thehand of the user, and thus no discomfort will be caused by the exhaustedhot air.

Referring to FIGS. 2A, 2B and 3A, 3B, the rotating angle of each fin 13varies according to different positions of the rotating shaft 131 in thefin 13. The outermost fin 13 has a mean line L approximately at thecenter of the fin 13, and thus the long side of the fin 13 is equallydivided into two parts. In the present invention, under the samedeformation volume, the angle of the fins 13 after being pulled by thememory deformable element 15 to swing is in inverse proportion to thedistance from the dowel hole 121 and the rotating shaft 131 to thememory deformable element 15. That is, if the rotating shaft 131 iscloser to the place where the memory deformable element 15 is connectedto the fin 13, the memory deformable element 15 under the samedeformation volume can pull the fin 13 to rotate by a larger angle. Inthe first embodiment, a distance from the place where the memorydeformable element 15 is connected to the fin 13 to the rotating shaft131 is approximately equal to a distance from the place where the memorydeformable element 15 is connected to the fin 13 to the mean line L,i.e., the rotating shaft 131 is disposed on the mean line L.

FIG. 4 shows a second embodiment of the present invention. Referring toFIG. 4, in the air guiding structure of this embodiment, a heatconductive member 16 is disposed between a heat dissipation element orheatsink (not shown, which for example is a heat pipe, a heatdissipation pad, or a heat dissipation fin set) of the notebook computerand the memory deformable element 15. In the first embodiment of thepresent invention, the heatsink fan 11 blows the hot air to the memorydeformable element 15, while in the second embodiment of the presentinvention, the heat generated by the heat dissipation element orheatsink is directly conducted to the memory deformable element 15, suchthat the memory deformable element 15 can reflect the actual operatingstatus of the notebook computer and pull the fins 13 to rotate to aworking angle in real time.

FIGS. 5A and 5B show a third embodiment of the present invention.Referring to FIGS. 5A and 5B, in the air guiding structure of thisembodiment, a restoring element 17 is disposed on the inner wall of theother side of the air outlet 12 opposite to the memory deformableelement 15. The restoring element 17 has one end fixed to a side edge ofthe inner wall of the air outlet 12, and the other end connected to thecorresponding outermost fin 13, i.e., the outermost fin 13 on the sideopposite to the memory deformable element 15. The restoring element 17is, but not limited to, a tension spring, and normally remains in acompressed state corresponding to the expanded and deformed state of thememory deformable element 15. When the memory deformable element 15 isin the contracted original state, the restoring element 17 is stretched,such that the restoring element 17 can assist the memory deformableelement 15 to restore the contracted original state when the notebookcomputer stops operating, and thus each fin 13 can restore its normalangle. Thereby, when the notebook computer stops operating, thetemperature of the memory deformable element 15 gradually drops to belowthe transition temperature. In this circumstance, the restoring element17 pulls the fins 13 at the normal temperature to make the memorydeformable element 15 restore the expanded and deformed state, and theactuation member 14 further pulls each fin 13 back to the normal angle.

FIG. 6 shows a fourth embodiment of the present invention. Referring toFIG. 6, in the first, second, and third embodiments, the memorydeformable element 15 is disposed on a side edge of the air outlet 12,and deforms in a direction perpendicular to the air outlet 12. However,in the fourth embodiment, the memory deformable element 15 is disposedin the notebook computer due to the inner space configuration of thenotebook computer, and can deform in a direction parallel to the airoutlet 12. Therefore, the memory deformable element 15 has one enddirectly fixed to a heat dissipation element or heatsink (not shown),and the other end fixed to a pull-rod 133 of the outermost fin 13, so asto pull the fins 13 to rotate.

FIGS. 7A, 7B, and 8 show a fifth embodiment of the present invention.Referring to FIGS. 7A, 7B, and 8, the structure of the air guidingstructure in the fifth embodiment is similar to that of the firstembodiment, and only the difference between the two embodiments will bedescribed below. In the fifth embodiment, the rotating shaft 131 and thedowel hole 121 of each fin 13 are disposed closer to the memorydeformable element 15 (compared with the first embodiment), i.e., adistance from the place where the memory deformable element 15 isconnected to the fin 13 to the rotating shaft 131 is smaller than adistance from the place where the memory deformable element 15 isconnected to the fin 13 to the mean line L. Thereby, the memorydeformable element 15 under the same deformation volume can pull thefins 13 to rotate by a larger angle (compared with the firstembodiment). Of course, the position rotating shaft 131 can remainunchanged, and the memory deformable element 15 is moved to the innerside of the air outlet 12 instead. In this circumstance, the memorydeformable element 15 under the same deformation volume can also pullthe fins 13 to rotate by a larger angle. Moreover, as shown in FIG. 8,the rotating shaft 131 and the dowel hole 121 of each fin 13 aredisposed further away from the memory deformable element 15, i.e., adistance from the place where the memory deformable element 15 isconnected to the fin 13 to the rotating shaft 131 is greater than adistance from the place where the memory deformable element 15 isconnected to the fin 13 to the mean line L, which also falls in thescope of the present invention.

FIG. 9 shows a sixth embodiment of the present invention. Referring toFIG. 9, the structure of the air guiding structure in the sixthembodiment is similar to that of the first embodiment, and only thedifference between the two embodiments will be described below. In thesixth embodiment, the memory deformable element 15 has one end fixed toa side edge of the inner wall of the air outlet 12, and the other enddirectly connected to the actuation member 14. Thus, compared with thefirst embodiment, the memory deformable element 15 of this embodimentdirectly pulls the actuation member 14, and accordingly the actuationmember 14 drives all the fins 13 to swing together.

FIGS. 10A and 10B show a seventh embodiment of the present invention.Referring to FIGS. 10A and 10B, the structure of the air guidingstructure in the seventh embodiment is similar to that of the firstembodiment, and only the difference between the two embodiments will bedescribed below. In the seventh embodiment, the memory deformableelement 15 is formed by two bar-shaped metal materials of differentthermal expansion coefficients. The memory deformable element 15 has oneend fixed to a side edge of the inner wall of the air outlet 12, and theother end movably connected to the fin 13. For example, the memorydeformable element 15 is inserted in a guide rod 134 of the fin 13 witha pillar 151. Thereby, when the memory deformable element 15 is heated,the two metal materials expand in different degrees due to theirdifferent thermal expansion coefficients, such that the memorydeformable element 15 bend toward the end of the metal material with alower thermal expansion coefficient when heated, so as to pull the fins13 to swing. Further, the actuation member 14 drives the fins 13 toswing together to a working angle. Meanwhile, this embodiment can alsochange the air exhaustion direction according to the temperature, andafter the normal temperature is restored, the memory deformable element15 can automatically return to its original state to pull the fins 13back to the normal angle.

1. An air guiding structure, disposed on an air outlet of an electronicdevice, the air guiding structure comprising: a plurality of fins,mounted in the air outlet and capable of rotating; and a memorydeformable element, having one end fixed to the electronic device, andthe other end connected to one of the fins, such that the memorydeformable element pulls the fins to swing together when deformingbecause of heat.
 2. The air guiding structure according to claim 1,further comprising an actuation member connected to the fins, so as todrive the fins to swing together.
 3. The air guiding structure accordingto claim 2, wherein a connection portion is disposed on each fin, aplurality of ferrules respectively corresponding to the connectionportions is disposed on the actuation member, the connection portions ofthe fins are respectively pivoted to the ferrules, such that the finsare capable of rotating together.
 4. The air guiding structure accordingto claim 1, further comprising a restoring element with one end disposedon a side edge of an inner wall of the air outlet, and the other endconnected to the outermost fin on a side opposite to the memorydeformable element, wherein the memory deformable element has anexpanded and deformed state at a normal temperature and a contractedoriginal state when heated, such that the fins remain at a normal angleand swing to a working angle respectively, and the restoring elementrestores the memory deformable element to the expanded and deformedstate at the normal temperature.
 5. The air guiding structure accordingto claim 1, wherein a plurality of dowel holes is respectively disposedat top and bottom of an inner wall of the air outlet, a pair of rotatingshafts is respectively disposed at top and bottom of each fin, and thefins swing by fitting the rotating shafts into the dowel holes.
 6. Theair guiding structure according to claim 5, wherein each fin has a meanline, and a distance from a place where the memory deformable element isconnected to the fin to the rotating shaft is smaller than a distancefrom the place where the memory deformable element is connected to thefin to the mean line.
 7. The air guiding structure according to claim 5,wherein each fin has a mean line, and a distance from a place where thememory deformable element is connected to the fin to the rotating shaftis equal to a distance from the place where the memory deformableelement is connected to the fin to the mean line.
 8. The air guidingstructure according to claim 5, wherein each fin has a mean line, and adistance from a place where the memory deformable element is connectedto the fin to the rotating shaft is greater than a distance from theplace where the memory deformable element is connected to the fin to themean line.
 9. The air guiding structure according to claim 1, furthercomprising a heat conductive member with one end connected to the memorydeformable element and the other end connected to a heatsink of theelectronic device.
 10. The air guiding structure according to claim 1,wherein one of the fins has a pull-rod, and the memory deformableelement has one end connected to the pull-rod and the other end fixed toa heat dissipation element of the electronic device.
 11. An air guidingstructure, disposed on an air outlet of an electronic device, the airguiding structure comprising: a plurality of fins, mounted in the airoutlet and capable of rotating; an actuation member, connected to thefins; and a memory deformable element, having one end fixed to theelectronic device, and the other end connected to the actuation member,such that the memory deformable element pulls the fins to swing togetherwhen deforming because of heat.
 12. The air guiding structure accordingto claim 11, wherein a connection portion is disposed on each fin, aplurality of ferrules respectively corresponding to the connectionportions is disposed on the actuation member, the connection portions ofthe fins are respectively pivoted to the ferrules, such that the finsare capable of rotating together.
 13. The air guiding structureaccording to claim 11, further comprising a restoring element with oneend disposed on a side edge of an inner wall of the air outlet, and theother end connected to the outermost fin on a side opposite to thememory deformable element, wherein the memory deformable element has anexpanded and deformed state at a normal temperature and a contractedoriginal state when heated, so that the fins remain at a normal angleand swing to a working angle respectively, and the restoring elementrestores the memory deformable element to the expanded and deformedstate at the normal temperature.
 14. The air guiding structure accordingto claim 11, wherein a plurality of dowel holes is respectively disposedat top and bottom of an inner wall of the air outlet, a pair of rotatingshafts is respectively disposed at top and bottom of each fin, and thefins swing by fitting the rotating shafts into the dowel holes.
 15. Theair guiding structure according to claim 11, further comprising a heatconductive member with one end connected to the memory deformableelement and the other end connected to a heatsink of the electronicdevice.
 16. The air guiding structure according to claim 11, wherein oneof the fins has a pull-rod, and the memory deformable element has oneend connected to the pull-rod and the other end fixed to a heatdissipation element of the electronic device.